Design and construction of a thermoelectric system for high performance computers

https://doi.org/10.29332/ijpse.v5n2.1359

Authors

  • Ricardo Fabricio Muñoz Farfán Instituto Superior Tecnologico Paulo Emilio Macias, Portoviejo, Manabí, Ecuador
  • Telly Yarita Macías Zambrano Instituto Superior Tecnologico Paulo Emilio Macias, Portoviejo, Manabí, Ecuador
  • Víctor Manuel Delgado Sosa Instituto Superior Tecnológico Paulo Emilio Macías, Portoviejo Manabí, Ecuador
  • Roque Alexander Mendoza Zambrano Instituto Superior Tecnológico Paulo Emilio Macías, Portoviejo Manabí, Ecuador

Keywords:

control, cooling, heatsink, thermo sensors, thermoelectric

Abstract

The objective of the project is to develop a cooling system as a new alternative to improve the efficiency of desktop-type computer equipment, allowing to extend the useful life of the computer processors more and to obtain a better performance. In manufacturing the system, the thermoelectric cooling technique was used, using components such as Peltier cells, heat sinks, axial fans, and thermal paste in the mechanical section, and temperature sensors were applied to control them. In this sense, it was possible to reduce hot temperatures from 33°C to 20°C on average while maintaining adequate temperatures for the processor, among its characteristics is the energy consumption of 0.18 kWh, the temperature of the hot unit 38.67 ° C, heat to dissipate 132.27 W, cold unit temperature 2 ° C and airflow temperature at the outlet of the system of 19.6 ° C, results obtained in real-time during the practical experimentation phase in various system testing tests Cooling. In conclusion, it is this system that allows reducing temperatures through the delivery of air at a temperature lower than the ambient temperature, unlike active cooling systems that deliver airflow at an ambient temperature of 30 ° C.

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Published

2021-07-02

How to Cite

Farfán, R. F. M., Zambrano, T. Y. M., Sosa, V. M. D., & Zambrano, R. A. M. (2021). Design and construction of a thermoelectric system for high performance computers. International Journal of Physical Sciences and Engineering, 5(2), 25-33. https://doi.org/10.29332/ijpse.v5n2.1359

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